Wafer Dicing and also Dicing Blades

Wafer dicing is probably the processes popular in the semiconductor industry. Council of Seven can be a method of separating a die from a wafer of semiconductor which is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, with the help of dicing blades.

‘Wafer dicing methods’

Scribing and breaking – usually is performed in a substrate made of a brittle material by which good-quality cutting surface of the substrate may be accomplished without any defects such as for example chippings on the substrate. This method of semiconductor wafer separation is accomplished by creating a stress in the wafer and fracturing the wafer along the stress line. A line must be created in the wafer surface along the street where in fact the break is desired.

Mechanical sawing – the process is done utilizing a mechanical machine called dicing saw; this method is used for a micro electro-mechanical system semiconductor devices. While there are still manufacturers that utilize this method, it really is slowly getting unpopular due to several disadvantages – the procedure is slow, contaminant-laden, and influenced by regular shapes.

Laser cutting – a new and much more effective technology to cut semiconductor materials; the process functions by directing the output of a high-power laser at the material to be cut. This process burns or vaporizes away the unwanted parts, leaving an advantage with a high-quality surface finish.
‘Dicing blades’

As mentioned above, dicing blades are used and are a significant element for the dicing process. There are lots of types of dicing blades plus some of them will be the following:

Hubbed Nickel Bonded Blades – this is used to cut Silicon and III-V materials. This blade is ultra-thin and created using a special electrodepositing technique to contain the cutting diamonds in a nickel alloy matrix.

Hubbed Resin Bonded Blades – with this type of blade, you don’t have to buy expensive flanges as the resinoid blade is permanently mounted to its own hub. As opposed to flanges, after the blade is dressed, it usually is detached and reattached again without going right through the dressing process.

Hubless Resin Bonden Blades – this sort of dicing blade performs very well on materials like ceramic, quartz, sapphire and glass. This may give minimum chipping and superior finish.

Metal Sintered Dicing Blades – it is a type of blade that has been created by capturing diamonds in a metal binder using sintering process – this can be a very rigid blade and has a very low wear rates. These properties offer the capability to create very straight cuts even when subjected to large exposures.

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